Contract Manufacturing

Our capabilities include:

Optoelectronic Chip Test Module Test & Characterization
Die Attach Laser Beam Analysis
Automated Fiber Alignment 20 GHz RF Test
Test and Burn-in Automated Module Test
Package Assembly Module Burn-in
Laser Welding Temperature Cycle
Hermetic Sealing High/Low Temperature Storage
Wire Bonding Serial Number Tracking System
Leak Test Manufacturing Database
Package Final Test & Burn-in Fiber Subassembly
Electronics Assembly Getter Fabrication
Module Assembly Unibond Fabrication