Our capabilities include:
|
Optoelectronic Chip Test |
Module Test & Characterization |
|
Die Attach |
Laser Beam Analysis |
|
Automated Fiber Alignment |
20 GHz RF Test |
|
Test and Burn-in |
Automated Module Test |
|
Package Assembly |
Module Burn-in |
|
Laser Welding |
Temperature Cycle |
|
Hermetic Sealing |
High/Low Temperature Storage |
|
Wire Bonding |
Serial Number Tracking System |
|
Leak Test |
Manufacturing Database |
|
Package Final Test & Burn-in |
Fiber Subassembly |
|
Electronics Assembly |
Getter Fabrication |
|
Module Assembly |
Unibond Fabrication |
